Qualcomm QCN9074 4x4 MIMO 802.11ax MX6974 F5 WIFI6 Module

Qualcomm QCN9074

Qualcomm QCN9074 is a 5G NR (New Radio) chipset developed by Qualcomm. It is designed for use in mobile devices, including smartphones, tablets, and other mobile computing devices, to provide high-speed wireless connectivity.

Qualcomm QCN9074 chipset is based on the 7nm process and is part of the Snapdragon X65 5G Modem-RF System. It supports 5G NR sub-6GHz and mmWave bands, as well as 4G LTE, 3G, and 2G cellular technologies. It also supports advanced features like beamforming, MIMO (Multiple Input, Multiple Output), and dynamic spectrum sharing (DSS), which enable faster and more reliable wireless connectivity.

In addition to its 5G capabilities,Qualcomm QCN9074 chipset also features advanced security features, including a hardware-based security processing unit (SPU) that provides enhanced security for user data and device integrity.

Overall,Qualcomm QCN9074 chipset is a powerful and versatile solution for mobile devices that require high-speed and reliable wireless connectivity.

MAXON QCN9074 Wireless Module

Nanjing MaXon Photoelectric Technology Co., Ltd. is a national high-tech enterprise focusing on industrial communication, integrating product research and development, manufacturing, sales and service. Adhering to the concept of "connect what you think, think what you connect", the company continues to create more convenient and cost-effective communication solutions for customers.Please feel free to contact us atinfo@maxonc.com . Check out our website, social media and online platforms for more details.

MAXONMX6974 F5 802.11ax Embedded Wireless modules that adopts M.2 E-key and supports PCI Express 3.0 protocol. It adopts Qualcomm QCN9074 802.11ax Wi-Fi technology, supports the 5180-5850GHz frequency band, has AP and STA functions with 4x4 MIMO and 4 spatial streams, suitable for applications of 5GHz IEEE802.11a/n/ac/ax. It is equipped with a dynamic frequency selection (DFS) function which has higher transmission efficiency than the previous generation.

Specifications

Type: Wireless Module

Chip: QCN9074

IEEE Standard: IEEE 802.11ax

Connector: PCI Express 3.0, M.2 E-key

Working voltage: 3.3V/5V

Frequency range: 5G：5.180GHz~5.850GHz

Modulation technology:

 802.11n：OFDM（BPSK，QPSK，16-QAM，64-QAM，256-QAM）

802.11ac：OFDM（BPSK，QPSK，16-QAM，64-QAM，256-QAM）

802.11ax：OFDMA（BPSK，QPSK，DBPSK，DQPSK，16-QAM，64-QAM，256-QAM，1024-QAM，4096-QAM）

Power (per chain): 802.11ax：Max. 21dBm

Power consumption: ≦15W

Receiving Sensitivity:

11ax:

HE20 MCS0 <-89dBm / MCS11 <-64dBm

HE40 MCS0 <-89dBm / MCS11 <-60dBm

HE80 MCS0 <-86dBm / MCS11 <-58dBm

Antenna Connector: 4 x U. FL

Operating Environment: Temperature: -20°C to 70°C/-4 ~ 158℉; Humidity: 95% (non-condensing)

Storage Environment: Temperature: -40°C to 90°C/-40 ~ 194℉; Humidity: 90% (non-condensing)

Certification: RoHS/REACH

Weight: 20g

Dimensions (W*H*D): 60 x 57 x 4.2 mm (±0.1mm)